HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 941

• Manufacturer Part Number: HD64F2239TF20I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239TF20I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

(4) DMAC Timing
Table 27.20 lists the DMAC timing.
Table 27.20 DMAC Timing
Condition A (F-ZTAT version and masked ROM version):
Condition B (Masked ROM version): V
Condition C (F-ZTAT version and masked ROM version):
Item
TEND delay time
DACK delay time 1
DACK delay time 2
DREQ setup time
DREQ hold time
Symbol
t
t
t
t
t
TED
DACD1
DACD2
DRQS
DRQH
Min
40
10
⎯
⎯
⎯
Condition A
V
V
T
V
T
T
V
V
20.0 MHz, T
T
Max
30
30
30
⎯
⎯
a
a
a
a
CC
ref
CC
ref
CC
ref
= –20°C to +75°C (regular specifications)
= –20°C to +75°C (regular specifications),
= –40°C to +85°C (wide-range specifications)
= 40°C to +85°C (wide-range specifications)
= 2.7 V to AV
= 2.2 V to AV
= 3.0 V to AV
= 2.7 V to 3.6 V, AV
= 2.2 V to 3.6 V, AV
= 3.0 V to 3.6 V, AV
Min
⎯
⎯
⎯
60
20
Condition B
a
= 20°C to +75°C (regular specifications),
Max
50
50
50
⎯
⎯
CC
CC
CC
Rev. 6.00 Mar. 18, 2010 Page 879 of 982
, V
, V
, V
SS
SS
SS
Min
⎯
⎯
⎯
30
10
Section 27 Electrical Characteristics
Condition C
= AV
= AV
= AV
CC
CC
CC
= 2.7 V to 3.6 V,
= 2.2 V to 3.6 V,
= 3.0 V to 3.6 V,
SS
SS
SS
Max
30
30
30
⎯
⎯
= 0 V, φ = 2 to 16.0 MHz,
= 0 V, φ = 2 to 6.25 MHz,
= 0 V, φ = 10.0 MHz to
Unit
ns
ns
ns
ns
ns
REJ09B0054-0600
Test Conditions
Figure 27.22
Figure 27.20
Figure 27.21
Figure 27.23