HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 922

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 27 Electrical Characteristics
27.2.4
Table 27.10 lists the A/D conversion characteristics.
Table 27.10 A/D Conversion Characteristics
Condition A: V
Rev. 6.00 Mar. 18, 2010 Page 860 of 982
REJ09B0054-0600
Item
Resolution
Conversion time
Analog input capacitance
Permissible signal-source impedance
Non-linearity error
Offset error
Full-scale error
Quantization error
Absolute accuracy
A/D Conversion Characteristics
V
specifications), T
CC
SS
= AV
= 4.0 V to 5.5 V, AV
SS
= 0 V, φ = 10 to 13.5 MHz, T
a
= –40°C to +85°C (wide-range specifications)
CC
= 3.0 V to 3.6 V, V
Min
10
9.6
a
= –20°C to +75°C (regular
Typ
10
Condition A
ref
= 3.0 V to AV
Max
10
20
5
±6.0
±4.0
±4.0
±0.5
±8.0
CC
,
Unit
LSB
LSB
LSB
LSB
LSB
bits
µs
pF

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