HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 41

• Manufacturer Part Number: HD64F2239TF20I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239TF20I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

27.7 Operating Timing..............................................................................................................948
27.8 Usage Note........................................................................................................................961
Appendix A I/O Port States in Each Pin State.................................................. 963
A.1
Appendix B Product Codes............................................................................... 968
Appendix C Package Dimensions..................................................................... 973
Index .................................................................................................................. 979
27.6.1 Absolute Maximum Ratings ................................................................................927
27.6.2 DC Characteristics ...............................................................................................928
27.6.3 AC Characteristics ...............................................................................................937
27.6.4 A/D Conversion Characteristics...........................................................................944
27.6.5 D/A Conversion Characteristics...........................................................................945
27.6.6 Flash Memory Characteristics .............................................................................946
27.7.1 Clock Timing .......................................................................................................948
27.7.2 Control Signal Timing .........................................................................................949
27.7.3 Bus Timing ..........................................................................................................950
27.7.4 Timing of On-Chip Peripheral Modules ..............................................................957
I/O Port State in Each Pin State ........................................................................................963
Rev. 6.00 Mar. 18, 2010 Page xxxix of lx
REJ09B0054-0600