HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 842

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 23 Clock Pulse Generator
23.7
23.7.1
To supply a clock to the subclock divider, connect a 32.768-kHz crystal resonator, as shown in
figure 23.8. Figure 23.9 shows the equivalence circuit for a 32.768-kHz oscillator.
Rev. 6.00 Mar. 18, 2010 Page 780 of 982
REJ09B0054-0600
OSC1
Connecting 32.768-kHz Crystal Resonator
Subclock Oscillator
Figure 23.8 Connection Example of 32.768-kHz Quartz Oscillator
Figure 23.9 Equivalence Circuit for 32.768-kHz Oscillator
Note: CL1 and CL2 are reference values including the floating
OSC2
OSC1
L
capacitance of the board.
s
C
s
C
o
C
C
1
2
R
C
Co = 1.5 pF (typ)
Rs = 14 kΩ (typ)
fw = 32.768 kHz
Type name = C001R (SEIKO EPSON)
s
1
= C
2
= 15 pF (typ)
OSC2

Related parts for HD64F2239TF20I