HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 824

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 22 PROM
Table 22.5 AC Characteristics in PROM Mode
(Conditions: V
Item
Address setup time
OE setup time
Data setup time
Address hold time
Data hold time
Data output disable time
V
Programming pulse width
PGM pulse width for overwrite
programming
V
CE setup time
Data output delay time
Notes: 1. Input pulse level: 0.8 V to 2.2 V
Rev. 6.00 Mar. 18, 2010 Page 762 of 982
REJ09B0054-0600
PP
CC
setup time
setup time
2. t
3. t
Input rise time/fall time ≤ 20 ns
Timing reference levels: Input:
longer be referenced.
DF
OPW
is defined to be when output has reached the open state, and the output level can no
CC
is defined by the value shown in the flowchart.
= 6.0 V ±0.25 V, V
Output: 0.8 V, 2.0 V
PP
= 12.5 V ±0.3 V, T
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
AS
OES
DS
AH
DH
DF
VPS
PW
OPW
VCS
CES
OE
*
2
*
3
1.0 V, 2.0 V
Min
2
2
2
0
2
2
0.19
0.19
2
2
0
a
Typ
0.20
= 25°C ±5°C)
Max
130
0.21
5.25
150
Unit
µs
µs
µs
µs
µs
ns
µs
ms
ms
µs
µs
ns
Test
Conditions
Figure 22.5 *
1

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