HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 916

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 27 Electrical Characteristics
(1) Clock Timing
Table 27.5 lists the clock timing.
Table 27.5 Clock Timing
Condition A: V
Rev. 6.00 Mar. 18, 2010 Page 854 of 982
REJ09B0054-0600
Item
Clock cycle time
Clock high pulse width
Clock low pulse width
Clock rise time
Clock fall time
Oscillation stabilization time at
reset (crystal)
Oscillation stabilization time in
software standby (crystal)
External clock output stabilization
delay time
32-kHz clock oscillation
stabilization time
Subclock oscillator frequency
Subclock (φ
SUB
) cycle time
V
specifications), T
CC
SS
= AV
= 4.0 V to 5.5 V, AV
SS
= 0 V, φ = 32.768 kHz, 10 to 13.5 MHz, T
a
= –40°C to +85°C (wide-range specifications)
Symbol
t
t
t
t
t
t
t
t
t
f
t
cyc
CH
CL
Cr
Cf
OSC1
OSC2
DEXT
OSC3
SUB
SUB
CC
= 4.0 V to 5.5 V, V
Min
74
25
25
20
8
500
32.768
30.5
Condition A
Max
100
10
10
2
32.768
30.5
ref
= 4.0 V to AV
a
= –20°C to +75°C (regular
Unit
ns
ns
ns
ns
ns
ms
ms
µs
s
kHz
µs
CC
,
Test Conditions
Figure 27.10
Figure 27.11
Figure 27.11

Related parts for HD64F2239TF20I