HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 826

• Manufacturer Part Number: HD64F2239TF20I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239TF20I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 22 PROM
• The size of the PROM is 128 kbytes. Always set addresses within the range H'00000 to
22.3.3
An effective way to assure the data retention characteristics of the programmed chips is to bake
them at 150°C, then screen them for data errors. This procedure quickly eliminates chips with
PROM memory cells prone to early failure.
Figure 22.6 shows the recommended screening procedure.
If a series of programming errors occurs while the same PROM programmer is being used, stop
programming and check the PROM programmer and socket adapter for defects.
Please inform Renesas Technology of any abnormal conditions noted during or after programming
or in screening of program data after high-temperature baking.
Rev. 6.00 Mar. 18, 2010 Page 764 of 982
REJ09B0054-0600
H'1FFFF. During programming, write H'FF to unused addresses to avoid verification errors.
Reliability of Programmed Data
Figure 22.6 Recommended Screening Procedure
Programing the chip and
Read and check program
hours at 125°C to 150°C
Bake chip for 24 to 48
verify programed data
with power off
Mount