HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 65

• Manufacturer Part Number: HD64F2239TF20I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239TF20I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

• Compact package
Notes: 1. Not supported by the H8S/2258 Group.
Package
TQFP-100
TQFP-100 *
QFP-100 *
QFP-100 *
LFBGA-112 *
TFBGA-112 *
2. Supported only by the H8S/2258 Group, H8S/2238B, H8S/2236B, H8S/2237 Group,
3. Not supported by the HD64F2227.
4. Supported only by the HD64F2238R.
5. Supported only by theHD64F2238R and HD64F2239.
6. Package code ending in the letter V designate Pb-free Product.
and HD6432227.
2
3
1
4
5
(Code) *
TFP-100B,
TFP-100BV
TFP-100G,
TFP-100GV
FP-100A, FP-100AV
FP-100B, FP-100BV
BP-112, BP-112V
TBP-112A,
TBP-112AV
6
Body Size
14.0 × 14.0 mm
12.0 × 12.0 mm
14.0 × 20.0 mm
14.0 × 14.0 mm
10.0 × 10.0 mm
10.0 × 10.0 mm
Rev. 6.00 Mar. 18, 2010 Page 3 of 982
Pin Pitch
0.5 mm
0.4 mm
0.65 mm
0.5 mm
0.8 mm
0.8 mm
Section 1 Overview
REJ09B0054-0600