HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 844

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 23 Clock Pulse Generator
23.9.2
When designing the board, place the crystal resonator and its load capacitors as close as possible
to the EXTAL, XTAL, OSC1, and OSC2 pins. Make wires as short as possible. Other signal lines
should be routed away from the oscillator circuit, as shown in figure 23.11. This is to prevent
induction from interfering with correct oscillation.
Rev. 6.00 Mar. 18, 2010 Page 782 of 982
REJ09B0054-0600
Note on Board Design
Figure 23.11 Note on Board Design of Oscillator Circuit
Avoid
C1
C2
Signal A Signal B
EXTAL, OSC1
XTAL, OSC2
This LSI

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