HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 328

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 8 DMA Controller (DMAC)
Figure 8.28 shows a transfer example in which TEND output is enabled and word-size single
address mode transfer (read) is performed from external 8-bit, 2-state access space to an external
device.
A byte or word transfer is performed for a single transfer request, and after the transfer, the bus is
released. While the bus is released, one or more bus cycles are executed by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
Rev. 6.00 Mar. 18, 2010 Page 266 of 982
REJ09B0054-0600
Address bus
DACK
TEND
RD
φ
Figure 8.28 Example of Single Address Mode (Word Read) Transfer
release
Bus
DMA read
release
Bus
DMA read
release
Bus
DMA read
Last transfer
cycle
DMA
dead
release
Bus

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