MM912H634DM1AER2 Freescale Semiconductor, MM912H634DM1AER2 Datasheet - Page 197

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MM912H634DM1AER2

Manufacturer Part Number
MM912H634DM1AER2
Description
16-bit Microcontrollers - MCU 64KS12 LIN2XLS/HS ISENSE
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MM912H634DM1AER2

Rohs
yes
Core
HCS12
Processor Series
MM912F634
Data Bus Width
16 bit
Maximum Clock Frequency
20 MHz
Program Memory Size
32 KB
Data Ram Size
2 KB
On-chip Adc
Yes
Operating Supply Voltage
5.5 V to 18 V
Operating Temperature Range
- 40 C to + 105 C
Package / Case
LQFP-48
Mounting Style
SMD/SMT
A/d Bit Size
10 bit
A/d Channels Available
15
Interface Type
SPI
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
15
Number Of Timers
1
Program Memory Type
Flash
Supply Voltage - Max
18 V
Supply Voltage - Min
5.5 V
Functional Description and Application Information
4.30.2
A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate with the BDM system.
During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin
becomes the dedicated serial interface pin for the background debug mode. The communication rate of this pin is based on the
DCO clock or external reference clock depending on the configuration selected (please refer to the S12S_CRG Block Guide for
more details) which gets divided by five. Hence the BDM serial interface clock is always DCO clock divided by five after reset in
to Special Single Chip mode which is about 6.4 MHz. After reset the BDM communication rate can be modified either via BDM
command or CPU user code. When modifying the DCO clock please make sure that the communication rate is adapted
accordingly and a communication timeout (BDM soft reset) has occurred.
4.30.3
4.30.3.1
Table 250
4.30.3.2
A summary of the registers associated with the BDM is shown in
communications to the BDM hardware using READ_BD and WRITE_BD commands.
Freescale Semiconductor
0x3_FF00
0x3_FF01
0x3_FF02
0x3_FF03
0x3_FF04
0x3_FF05
0x3_FF06
0x3_FF07
Address
Global
Table 250. BDM Memory Map
shows the BDM memory map when BDM is active.
0x3_FF0C–0x3_FF0E
External Signal Description
Memory Map and Register Definition
0x3_FF00–0x3_FF0B
0x3_FF10–0x3_FFFF
BDMCCR
Reserved
BDMSTS
Reserved
Reserved
Reserved
Reserved
Reserved
Register
Module Memory Map
Register Descriptions
Global Address
Name
0x3_FF0F
W
W
W
W
W
W
W
W
R
R
R
R
R
R
R
R
ENBDM
CCR7
Bit 7
X
X
X
X
X
0
BDMACT
Figure 60. BDM Register Summary
CCR6
X
X
X
X
X
6
0
Family ID (part of BDM firmware ROM)
CCR5
BDM firmware ROM
BDM firmware ROM
X
X
X
X
X
5
0
0
BDM registers
Module
Figure
CCR4
SDV
4
X
X
X
X
X
0
60. Registers are accessed by host-driven
TRACE
Background Debug Module (S12SBDMV1)
CCR3
3
X
X
X
X
X
0
CCR2
2
X
0
X
X
X
X
0
Size (Bytes)
240
UNSEC
12
CCR1
3
1
X
X
X
X
1
0
0
MM912F634
CCR0
Bit 0
X
X
X
X
0
0
0
197

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