MM912H634DM1AER2 Freescale Semiconductor, MM912H634DM1AER2 Datasheet - Page 337

• Manufacturer Part Number: MM912H634DM1AER2
• Description: 16-bit Microcontrollers - MCU 64KS12 LIN2XLS/HS ISENSE
• Manufacturer: Freescale Semiconductor

Specifications of MM912H634DM1AER2

• Rohs: yes
• Core: HCS12
• Processor Series: MM912F634
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 20 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 5.5 V to 18 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: LQFP-48
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit
• A/d Channels Available: 15
• Interface Type: SPI
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 15
• Number Of Timers: 1
• Program Memory Type: Flash
• Supply Voltage - Max: 18 V
• Supply Voltage - Min: 5.5 V

Revision History
6
Freescale Semiconductor
.
Revision
1.0
2.0
3.0
4.0
5.0
6.0
Revision History
05/2010
10/2010
10/2010
11/2010
7/2010
9/2012
Date
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Initial release.
MM912F634Cxxxx (Revision C) Introduced
MM912F634Cxxxx (Revision C) Lx Input Threshold / Hysteresis Limit added. See Table 23,
Static Electrical Characteristics - High Voltage Inputs - Lx
V
Regulator 5.0 V (VDDX)
I
Regulator 5.0 V (VDDX)
I
Characteristics - Voltage Regulator 2.5 V (VDD)
I
Voltage Regulator 2.5 V (VDD)
TSg typical value changed to 9.17 mV/k. See Table 27, Static Electrical Characteristics -
Temperature Sensor - TSENSE
Deleted devices MM912F634BC1AE, MM912F634BV2AE, MM912F634BC2AE,
MM912F634BV3AE, MM912F634BC3AE, MM912F634CC1AE, MM912F634CC2AE,
MM912F634CV3AE, MM912F634CC3AE from Table 1, Ordering Information, as well as
references to these devices in sections 3.5, 3.6 & 3.7
Deleted "Data Flash" column in Table 1, Ordering Information, since this feature is not
available for the MM912F634
Deleted all references to Analog Options "A3" & "A4" in Section 4.1.3, Analog Die Options
Changed Analog Option designations from "A1" & "A2" to "1" & "2", respectively, in Table 1,
Ordering Information, and Table 2, Analog Options
Clarified instructions on use of unused pins in devices with Analog Option "2"
Changed MM912F634Cxxxx Lx High Detection Threshold V
the range 7.0 V ≤ VSUP ≤ 27 V. Changed max & typical Hysteresis V
MM912F634Cxxxx. Applied these new values to the full range of 5.5 V ≤ VSUP ≤ 27 V. See
Table 19, Static Electrical Characteristics - High Voltage Inputs – Lx
Added separate HBM ESD rating (V
Latch-up Protection Characteristics
Added MM912F634CV2AP to the ordering information
Updated to standard form and style
Added the 98ASA00173D (48-PIN LQFP) package drawing to the Packaging section
Added symbol f
Replaced all references to 20 MHz bus frequency with f
to Table 1. See Table 8 – Operating Conditions, Table 9 – Supply Currents, Table 28 –
Dynamic Electrical Characteristics – Die to Die Interface – D2D.
Added reference to 16 MHz maximum CPU Bus Frequency for MM1912F634CV2AP to
section 4.25.1.1 (MM912F634 – MCU Die Overview: Features)
Changed Baud Rate data to reflect a 20 MHz Bus Clock in Table 409 – Example SPI Baud
Rate Selection.
Removed part number MM912F634BV1AE from data sheet.
Corrected several typos throughout the document - No technical changes
Added MM912F634DV1AE, MM912F634DV2AE, MM912F634DV2AP to the ordering
information.
Redefined R
VDDLIMXSTOP
VDDLIMRUN
VDDLIMSTOP
DDXSTOP
minimum value deleted. See Table 17, Static Electrical Characteristics - Voltage
minimum value deleted for all values of T
θJA
minimum value deleted. See Table 18, Static Electrical Characteristics -
ratings changed. See Table 17, Static Electrical Characteristics - Voltage
BUSMAX
for both LQFP packages.
to Max. Bus Frequency (MHz) column in Table 1.
Description
HBM
) for HSx pins of +/-3000V. See Table 46, ESD and
J
. See Table 18, Static Electrical
BUSMAX
THH (min)
, and added a note referring
Package Dimensions
from 2.7 V to 2.6 V for
HYS
for
MM912F634
337