HD6417706F133 Renesas Electronics America, HD6417706F133 Datasheet - Page 327

• Manufacturer Part Number: HD6417706F133
• Description: IC SUPERH MPU ROMLESS 176LQFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of HD6417706F133

• Core Processor: SH-3
• Core Size: 32-Bit
• Speed: 133MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.75 V ~ 2.05 V
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 176-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Figure 9.9 Operation in the Indirect Address mode in the Dual Address Mode
Note:
When the value in SAR_3 is an address, the memory data is read and the value is
stored in the temporary buffer. The value to be read must be 32 bits since it is used
for the address.
When the value in the temporary buffer is an address, the data is read from the
transfer source module to the data buffer.
When the value in SAR_3 is an address, the value in the data buffer is written to the
transfer source module.
The above description uses the memory, transfer source module, or transfer
destination module; in practice, any module can be connected in the addressing
space.
(When the External Memory Space Has a 16-Bit Width)
M
M
M
D
A
C
D
A
C
D
A
C
Temporary
Temporary
Temporary
SAR_3
DAR_3
SAR_3
DAR_3
SAR_3
DAR_3
buffer
buffer
buffer
buffer
buffer
buffer
Data
Data
Data
First and second bus cycles
Third bus cycle
Fourth bus cycle
Section 9 Direct Memory Access Controller (DMAC)
Rev. 5.00 May 29, 2006 page 277 of 698
Transfer source module
Transfer source module
Transfer source module
Transfer destination
Transfer destination
Transfer destination
Memory
Memory
Memory
module
module
module
REJ09B0146-0500