HD6417706F133 Renesas Electronics America, HD6417706F133 Datasheet - Page 329

• Manufacturer Part Number: HD6417706F133
• Description: IC SUPERH MPU ROMLESS 176LQFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of HD6417706F133

• Core Processor: SH-3
• Core Size: 32-Bit
• Speed: 133MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.75 V ~ 2.05 V
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 176-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Two kinds of transfer are possible in the single address mode: (1) transfer between an external
device with DACK and a memory-mapped external device, and (2) transfer between an external
device with DACK and external memory. In both cases, only the external request signal (DREQ)
is used for transfer requests.
Single Address Mode
In the single address mode, either the transfer source or transfer destination external device is
accessed (selected) by means of the DACK signal, and the other device is accessed by address.
In this mode, the DMAC performs one DMA transfer in one bus cycle, accessing one of the
external devices by outputting the DACK transfer request acknowledge signal to it, and at the
same time outputting an address to the other device involved in the transfer. For example, in
the case of transfer between external memory and an external device with DACK, as shown in
figure 9.11, when the external device outputs data to the data bus, that data is written to the
external memory in the same bus cycle.
SH7706
Data flow
Figure 9.11 Data Flow in the Single Address Mode
DMAC
External address bus
DACK
DREQ
Section 9 Direct Memory Access Controller (DMAC)
External data bus
Rev. 5.00 May 29, 2006 page 279 of 698
External device
with DACK
External
memory
REJ09B0146-0500