R8A77800ANBGAV Renesas Electronics America, R8A77800ANBGAV Datasheet - Page 28

• Manufacturer Part Number: R8A77800ANBGAV
• Description: IC SUPERH MPU ROMLESS 449-BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7780r

Specifications of R8A77800ANBGAV

• Core Processor: SH-4A
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: Audio Codec, MMC, Serial Sound, SCI, SIO, SPI, SSI
• Peripherals: DMA, POR, WDT
• Number Of I /o: 75
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.35 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 449-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

29.6 Usage Notes ..................................................................................................................... 1132
Section 30 User Debugging Interface (H-UDI)............................................... 1135
30.1 Features............................................................................................................................ 1135
30.2 Input/Output Pins............................................................................................................. 1137
30.3 Boundary Scan TAP Controllers
30.4 Register Descriptions....................................................................................................... 1140
30.5 Operation ......................................................................................................................... 1152
30.6 Usage Notes ..................................................................................................................... 1154
Section 31 Electrical Characteristics ............................................................... 1155
31.1 Absolute Maximum Ratings ............................................................................................ 1155
31.2 DC Characteristics ........................................................................................................... 1156
31.3 AC Characteristics ........................................................................................................... 1159
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(IDCODE, EXTEST, SAMPLE/PRELOAD, and BYPASS) .......................................... 1138
30.4.1 Instruction Register (SDIR) ................................................................................ 1141
30.4.2 Interrupt Source Register (SDINT)..................................................................... 1142
30.4.3 Bypass Register (SDBPR) .................................................................................. 1142
30.4.4 Boundary Scan Register (SDBSR) ..................................................................... 1143
30.5.1 TAP Control ....................................................................................................... 1152
30.5.2 H-UDI Reset ....................................................................................................... 1153
30.5.3 H-UDI Interrupt .................................................................................................. 1153
31.3.1 Clock and Control Signal Timing ....................................................................... 1160
31.3.2 Control Signal Timing ........................................................................................ 1163
31.3.3 Bus Timing ......................................................................................................... 1164
31.3.4 DDRIF Signal Timing ........................................................................................ 1182
31.3.5 INTC Module Signal Timing.............................................................................. 1186
31.3.6 PCIC Module Signal Timing .............................................................................. 1188
31.3.7 DMAC Module Signal Timing ........................................................................... 1190
31.3.8 TMU Module Signal Timing .............................................................................. 1191
31.3.9 CMT Module Signal Timing .............................................................................. 1192
31.3.10 SCIF Module Signal Timing............................................................................... 1193
31.3.11 SIOF Module Signal Timing .............................................................................. 1195
31.3.12 HSPI Module Signal Timing .............................................................................. 1199
31.3.13 MMCIF Module Signal Timing.......................................................................... 1201
31.3.14 HAC Interface Module Signal Timing ............................................................... 1203
31.3.15 SSI Interface Module Signal Timing .................................................................. 1205
31.3.16 FLCTL Module Signal Timing........................................................................... 1207
31.3.17 GPIO Signal Timing ........................................................................................... 1211
31.3.18 H-UDI Module Signal Timing............................................................................ 1212