R5F2L3AAANFP#U1 Renesas Electronics America, R5F2L3AAANFP#U1 Datasheet - Page 744

• Manufacturer Part Number: R5F2L3AAANFP#U1
• Description: MCU FLASH 96+4KB 100LQFP
• Manufacturer: Renesas Electronics America
• Series: R8C/Lx/3AAr

Specifications of R5F2L3AAANFP#U1

• Core Processor: R8C
• Core Size: 16/32-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SIO, SSU, UART/USART
• Peripherals: LCD, POR, PWM, Voltage Detect, WDT
• Number Of I /o: 88
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 20x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

R8C/L35A Group, R8C/L36A Group, R8C/L38A Group, R8C/L3AA Group,
R8C/L35B Group, R8C/L36B Group, R8C/L38B Group, R8C/L3AB Group
REJ09B0441-0100 Rev.1.00
Page 707 of 802
Figure 33.5
33.4.9
When the program ROM area is specified while a program or block erase operation to the data flash, array data
can be read. This eliminates the need for writing software commands. Access time is the same as for normal
read operations.
Figure 33.5 shows the BGO Function.
Data flash
Program ROM
BGO (BackGround Operation) Function
BGO Function
Oct 30, 2009
Read
Read
Erase/program
Read
Read
Time
33. Flash Memory