LPC1837FET256,551 NXP Semiconductors, LPC1837FET256,551 Datasheet - Page 7

• Manufacturer Part Number: LPC1837FET256,551
• Description: Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
• Manufacturer: NXP Semiconductors
• Series: LPC18xxr

Specifications of LPC1837FET256,551

• Core: ARM Cortex M3
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 136K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / Rohs Status: Details
• Other names: 935293795551

NXP Semiconductors
1.3 Ordering information (flashless parts LPC1850/30/20/10)
Table 1.
Table 2.
<Document ID>
User manual
Type number
LPC1850FET256
LPC1850FET180
LPC1850FBD208 LQFP208
LPC1830FET256
LPC1830FET180
LPC1830FET100
LPC1830FBD144 LQFP144
LPC1820FET100
LPC1820FBD144 LQFP144
LPC1820FBD100 LQFP100
LPC1810FET100
Type number
LPC1850FET256
LPC1850FET180
LPC1850FBD208 200 kB
LPC1830FET256
LPC1830FET180
LPC1830FET100
LPC1830FBD144 200 kB
LPC1820FET100
LPC1820FBD144 168 kB
LPC1820FBD100 168 kB
LPC1810FET100
Ordering information
Ordering options
Package
Name
LBGA256
TFBGA180 Thin fine-pitch ball grid array package; 180 balls
LBGA256
TFBGA180 Thin fine-pitch ball grid array package; 180 balls
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
Total SRAM
200 kB
200 kB
200 kB
200 kB
200 kB
168 kB
136 kB
•
– Wake-up from Deep-sleep, Power-down, and Deep power-down modes via
– Brownout detect with four separate thresholds for interrupt and forced reset.
– Power-On Reset (POR).
Available as 100-pin, 144-pin, and 208-pin LQFP packages and as 100-pin, 180-pin,
and 256-pin LBGA packages.
external interrupts and interrupts generated by battery powered blocks in the RTC
power domain.
Description
Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm
Plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm
Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm
Plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
Plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
Plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
LCD
yes
yes
yes
no
no
no
no
no
no
no
no
All information provided in this document is subject to legal disclaimers.
Ethernet USB0 (Host,
yes
yes
yes
yes
yes
yes
yes
no
no
no
no
Rev. 00.13 — 20 July 2011
Device, OTG)
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
no
USB1 (Host,
Device)
yes
yes
yes
yes
yes
no
no
yes
yes
no
no
Chapter 1: Introductory information
GPIO
164
118
164
164
118
49
83
49
83
49
49
UM10430
© NXP B.V. 2011. All rights reserved.
Package
LBGA256
TFBGA180
LQFP208
LBGA256
LQFP144
LQFP144
LQFP100
TFBGA180
TFBGA100
TFBGA100
TFBGA100
Version
sot740-2
sot570-3
sot459-1
sot740-2
sot570-3
sot926-1
sot486-1
sot926-1
sot486-1
sot407-1
sot926-1
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