UPD70F3740GC-UEU-AX Renesas Electronics America, UPD70F3740GC-UEU-AX Datasheet - Page 15

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UPD70F3740GC-UEU-AX

Manufacturer Part Number
UPD70F3740GC-UEU-AX
Description
MCU 32BIT V850ES/JX3 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3740GC-UEU-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
NEC
Quantity:
300
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
CHAPTER 23 CLOCK MONITOR ........................................................................................................ 702
CHAPTER 24 LOW-VOLTAGE DETECTOR (LVI) ............................................................................. 707
CHAPTER 25 CRC FUNCTION............................................................................................................ 714
CHAPTER 26 REGULATOR ................................................................................................................. 719
CHAPTER 27 FLASH MEMORY .......................................................................................................... 721
CHAPTER 28 ON-CHIP DEBUG FUNCTION ..................................................................................... 746
23.1
23.2
23.3
23.4
24.1
24.2
24.3
24.4
24.5
24.6
25.1
25.2
25.3
25.4
25.5
26.1
26.2
27.1
27.2
27.3
27.4
27.5
28.1
22.3.5
Functions............................................................................................................................... 702
Configuration ........................................................................................................................ 702
Register ................................................................................................................................. 703
Operation............................................................................................................................... 704
Functions............................................................................................................................... 707
Configuration ........................................................................................................................ 707
Registers ............................................................................................................................... 708
Operation............................................................................................................................... 710
24.4.1
24.4.2
RAM Retention Voltage Detection Operation .................................................................... 712
Emulation Function .............................................................................................................. 713
Functions............................................................................................................................... 714
Configuration ........................................................................................................................ 714
Registers ............................................................................................................................... 715
Operation............................................................................................................................... 716
Usage Method ....................................................................................................................... 717
Overview................................................................................................................................ 719
Operation............................................................................................................................... 720
Features................................................................................................................................. 721
Memory Configuration ......................................................................................................... 722
Functional Outline ................................................................................................................ 724
Rewriting by Dedicated Flash Programmer....................................................................... 727
27.4.1
27.4.2
27.4.3
27.4.4
27.4.5
27.4.6
Rewriting by Self Programming .......................................................................................... 741
27.5.1
27.5.2
27.5.3
27.5.4
27.5.5
27.5.6
Debugging with DCU ............................................................................................................ 747
Reset function operation flow...................................................................................................701
To use for internal reset signal.................................................................................................710
To use for interrupt...................................................................................................................711
Programming environment.......................................................................................................727
Communication mode ..............................................................................................................728
Flash memory control ..............................................................................................................734
Selection of communication mode ...........................................................................................735
Communication commands......................................................................................................736
Pin connection .........................................................................................................................737
Overview..................................................................................................................................741
Features...................................................................................................................................742
Standard self programming flow ..............................................................................................743
Flash functions.........................................................................................................................744
Pin processing .........................................................................................................................744
Internal resources used ...........................................................................................................745

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