UPD70F3740GC-UEU-AX Renesas Electronics America, UPD70F3740GC-UEU-AX Datasheet - Page 621

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UPD70F3740GC-UEU-AX

Manufacturer Part Number
UPD70F3740GC-UEU-AX
Description
MCU 32BIT V850ES/JX3 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3740GC-UEU-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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V850ES/JG3
17.17 Timing of Data Communication
devices as its communication partner.
direction, and then starts serial communication with the slave device.
transmit data is transferred to the SO latch and is output (MSB first) via the SDA0n pin.
R01UH0015EJ0300 Rev.3.00
Sep 30, 2010
When using I
After outputting the slave address, the master device transmits the IICSn.TRCn bit, which specifies the data transfer
The shift operation of the IICn register is synchronized with the falling edge of the serial clock pin (SCL0n). The
Data input via the SDA0n pin is captured by the IICn register at the rising edge of the SCL0n pin.
The data communication timing is shown below.
Remark
n = 0 to 2
2
C bus mode, the master device outputs an address via the serial bus to select one of several slave
CHAPTER 17 I
Page 605 of 870
2
C BUS

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