UPD70F3740GC-UEU-AX Renesas Electronics America, UPD70F3740GC-UEU-AX Datasheet - Page 806

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UPD70F3740GC-UEU-AX

Manufacturer Part Number
UPD70F3740GC-UEU-AX
Description
MCU 32BIT V850ES/JX3 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3740GC-UEU-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
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Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
Renesas Electronics America
Quantity:
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Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
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V850ES/JG3
(b) CLKOUT synchronous
(T
Remark The values in the above specifications are values for when clocks with a 1:1 duty ratio are input from X1.
Bus Hold (CLKOUT Synchronous)
R01UH0015EJ0300 Rev.3.00
Sep 30, 2010
Address bus (output)
WR0, WR1 (output)
A
HLDRQ setup time (to CLKOUT↓)
HLDRQ hold time (from CLKOUT↓)
Delay time from CLKOUT↑ to bus float
Delay time from CLKOUT↑ to HLDAK
= −40 to +85°C, V
CLKOUT (output)
HLDAK (output)
HLDRQ (input)
ASTB (output)
Data bus (I/O)
RD (output),
Parameter
DD
= EV
<83>
T2
DD
<84>
= AV
REF0
T3
= AV
t
t
t
t
SHQK
HKHQ
DKF
DKHA
REF1
Symbol
, V
TI
<85>
SS
= EV
<83>
<84>
<85>
<86>
<86>
CHAPTER 29
SS
TH
= AV
Conditions
SS
= 0 V, C
TH
L
Hi-Z
Hi-Z
Hi-Z
ELECTRICAL SPECIFICATIONS
= 50 pF)
<83>
TH
MIN.
20
5
<86>
TI
MAX.
19
19
Page 790 of 870
Unit
ns
ns
ns
ns

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