UPD70F3740GC-UEU-AX Renesas Electronics America, UPD70F3740GC-UEU-AX Datasheet - Page 190

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UPD70F3740GC-UEU-AX

Manufacturer Part Number
UPD70F3740GC-UEU-AX
Description
MCU 32BIT V850ES/JX3 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3740GC-UEU-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
NEC
Quantity:
300
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
V850ES/JG3
R01UH0015EJ0300 Rev.3.00
Sep 30, 2010
Note This idle state (TI) does not depend on the BCC register settings.
Remark
Remarks 1. TASW (address setup wait): Image of high-level width of T1 state expanded.
AD7 to AD0
WR1, WR0
A21 to A0
CLKOUT
HLDRQ
HLDAK
AD15 to AD0
2. TAHW (address hold wait): Image of low-level width of T1 state expanded.
3. The broken lines indicate high impedance.
The broken lines indicate high impedance.
Figure 5-14. Address Wait Timing (Separate Bus Read, Bus Size: 16 Bits, 16-Bit Access)
A21 to A0
CLKOUT
11
ASTB
WAIT
T1
RD
A1
10
Figure 5-13. Separate Bus Hold Timing (Bus Size: 8 Bits, Write)
T2
D1
T1
11
T1
A1
D1
A2
T2
10
T2
D2
Undefined
11
TI
AD15 to AD0
Note
A21 to A0
CLKOUT
ASTB
WAIT
TH
RD
TH
TASW
CHAPTER 5 BUS CONTROL FUNCTION
TH
T1
TH
A1
TAHW
Undefined
D1
TI
Note
11
T2
T1
Page 174 of 870
A3
10
T2
D3
11

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