UPD70F3740GC-UEU-AX Renesas Electronics America, UPD70F3740GC-UEU-AX Datasheet - Page 16

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UPD70F3740GC-UEU-AX

Manufacturer Part Number
UPD70F3740GC-UEU-AX
Description
MCU 32BIT V850ES/JX3 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3740GC-UEU-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
NEC
Quantity:
300
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
CHAPTER 29 ELECTRICAL SPECIFICATIONS ................................................................................. 765
CHAPTER 30 PACKAGE DRAWING .................................................................................................. 800
CHAPTER 31 RECOMMENDED SOLDERING CONDITIONS........................................................... 801
APPENDIX A DEVELOPMENT TOOLS............................................................................................... 802
APPENDIX B MAJOR DIFFERENCES BETWEEN V850ES/JG3 AND V850ES/JG2.................... 812
APPENDIX C REGISTER INDEX ......................................................................................................... 814
APPENDIX D INSTRUCTION SET LIST ............................................................................................. 824
APPENDIX E LIST OF CAUTIONS ..................................................................................................... 834
APPENDIX F REVISION HISTORY...................................................................................................... 870
28.2
28.3
A.1
A.2
A.3
A.4
A.5
A.6
A.7
D.1
D.2
F.1
F.2
Major Revisions in This Edition .......................................................................................... 870
28.1.1
28.1.2
28.1.3
28.1.4
28.1.5
28.1.6
Debugging Without Using DCU........................................................................................... 752
28.2.1
28.2.2
28.2.3
28.2.4
ROM Security Function........................................................................................................ 762
28.3.1
28.3.2
Software Package ................................................................................................................. 804
Language Processing Software .......................................................................................... 804
Control Software................................................................................................................... 804
Debugging Tools (Hardware) .............................................................................................. 805
A.4.1
A.4.2
A.4.3
Debugging Tools (Software)................................................................................................ 809
Embedded Software ............................................................................................................. 810
Flash Memory Writing Tools ............................................................................................... 811
Conventions .......................................................................................................................... 824
Instruction Set (in Alphabetical Order) .............................................................................. 827
Revision History of Previous Editions ............................................................................... 870
Connection circuit example ......................................................................................................747
Interface signals.......................................................................................................................747
Maskable functions ..................................................................................................................749
Register ...................................................................................................................................749
Operation .................................................................................................................................751
Cautions...................................................................................................................................751
Circuit connection examples ....................................................................................................752
Maskable functions ..................................................................................................................753
Securement of user resources .................................................................................................754
Cautions...................................................................................................................................760
Security ID ...............................................................................................................................762
Setting......................................................................................................................................763
When using IECUBE QB-V850ESSX2 ....................................................................................805
When using MINICUBE QB-V850MINI ....................................................................................807
When using MINICUBE2 QB-MINI2.........................................................................................808

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