UPD70F3740GC-UEU-AX Renesas Electronics America, UPD70F3740GC-UEU-AX Datasheet - Page 755

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UPD70F3740GC-UEU-AX

Manufacturer Part Number
UPD70F3740GC-UEU-AX
Description
MCU 32BIT V850ES/JX3 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3740GC-UEU-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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V850ES/JG3
R01UH0015EJ0300 Rev.3.00
Sep 30, 2010
(b) Malfunction of other device
When the dedicated flash programmer (output or input) is connected to a serial interface pin (input or output)
that is connected to another device (input), the signal is output to the other device, causing the device to
malfunction. To avoid this, isolate the connection to the other device.
V850ES/JG3
V850ES/JG3
Pin
Pin
In the flash memory programming mode, if the signal the V850ES/JG3
outputs affects the other device, isolate the signal on the other device side.
In the flash memory programming mode, if the signal the dedicated flash
programmer outputs affects the other device, isolate the signal on the other
device side.
Figure 27-13. Malfunction of Other Device
Dedicated flash programmer
connection pin
Dedicated flash programmer
connection pin
Other device
Other device
Input pin
Input pin
CHAPTER 27 FLASH MEMORY
Page 739 of 870

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