UPD70F3740GC-UEU-AX Renesas Electronics America, UPD70F3740GC-UEU-AX Datasheet - Page 738

no-image

UPD70F3740GC-UEU-AX

Manufacturer Part Number
UPD70F3740GC-UEU-AX
Description
MCU 32BIT V850ES/JX3 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3r
Datasheet

Specifications of UPD70F3740GC-UEU-AX

Core Processor
RISC
Core Size
32-Bit
Speed
32MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
NEC
Quantity:
300
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
UPD70F3740GC-UEU-AX
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
V850ES/JG3
27.2 Memory Configuration
All or some of the blocks can also be erased at once.
the physical memory allocated at the addresses of blocks 16 to 31. For details of the boot swap function, see 27.5
Rewriting by Self Programming.
R01UH0015EJ0300 Rev.3.00
Sep 30, 2010
The V850ES/JG3 internal flash memory area is divided into 4 KB blocks and can be programmed/erased in block units.
When the boot swap function is used, the physical memory allocated at the addresses of blocks 0 to 15 is replaced by
CHAPTER 27 FLASH MEMORY
Page 722 of 870

Related parts for UPD70F3740GC-UEU-AX