UPD70F3451GC-UBT-A Renesas Electronics America, UPD70F3451GC-UBT-A Datasheet - Page 1161

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UPD70F3451GC-UBT-A

Manufacturer Part Number
UPD70F3451GC-UBT-A
Description
MCU 32BIT 128KB FLASH 80LQFP
Manufacturer
Renesas Electronics America
Series
V850E/Ix3r
Datasheet

Specifications of UPD70F3451GC-UBT-A

Core Processor
RISC
Core Size
32-Bit
Speed
64MHz
Connectivity
CSI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
44
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3.5 V ~ 5.5 V
Data Converters
A/D 10x12b, 4x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3451GC-UBT-A
Manufacturer:
Renesas Electronics America
Quantity:
10 000
(1)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with -A at the end of the part number are lead-free products.
Infrared reflow
Wave soldering
Partial heating
Soldering Method
The V850E/IF3 and V850E/IG3 should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μ
μ
μ
μ
PD70F3451GC-UBT-A: 80-pin plastic LQFP (14 × 14)
PD70F3452GC-UBT-A: 80-pin plastic LQFP (14 × 14)
PD70F3453GC-8EA-A: 100-pin plastic LQFP (fine pitch) (14 × 14)
PD70F3454GC-8EA-A: 100-pin plastic LQFP (fine pitch) (14 × 14)
2. For soldering methods and conditions other than those recommended above, please contact an NEC
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less,
Exposure limit: 7 days
For details, contact an NEC Electronics sales representative.
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
Table 30-1. Surface Mounting Type Soldering Conditions (1/2)
Note
(after that, prebake at 125°C for 10 to 72 hours)
User’s Manual U18279EJ3V0UD
Soldering Conditions
IR60-107-3
Condition Symbol
Recommended
1159

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