UPD70F3451GC-UBT-A Renesas Electronics America, UPD70F3451GC-UBT-A Datasheet - Page 1162

• Manufacturer Part Number: UPD70F3451GC-UBT-A
• Description: MCU 32BIT 128KB FLASH 80LQFP
• Manufacturer: Renesas Electronics America
• Series: V850E/Ix3r

Specifications of UPD70F3451GC-UBT-A

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CSI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 44
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3.5 V ~ 5.5 V
• Data Converters: A/D 10x12b, 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

(2)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with -AX at the end of the part number are lead-free products.
(3)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together.
Remarks 1. Products with -A at the end of the part number are lead-free products.
1160
Infrared reflow
Wave soldering
Partial heating
Infrared reflow
Wave soldering
Soldering Method
Soldering Method
μ
μ
μ
PD70F3453GF-GAS-AX:
PD70F3454GF-GAS-AX:
PD70F3454F1-DA9-A:
2. For soldering methods and conditions other than those recommended above, please contact an NEC
2. For soldering methods and conditions other than those recommended above, please contact an NEC
Electronics sales representative.
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less,
Exposure limit: 7 days
For details, contact an NEC Electronics sales representative.
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less,
Exposure limit: 7 days
For details, contact an NEC Electronics sales representative.
Table 30-1. Surface Mounting Type Soldering Conditions (2/2)
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
100-pin plastic LQFP (14 × 20)
100-pin plastic LQFP (14 × 20)
161-pin plastic FBGA (10 × 10)
Note
Note
(after that, prebake at 125°C for 20 to 72 hours)
(after that, prebake at 125°C for 20 to 72 hours)
User’s Manual U18279EJ3V0UD
Soldering Conditions
Soldering Conditions
IR60-207-3
IR60-207-3
Condition Symbol
Condition Symbol
Recommended
Recommended
–
–
–