MCBSTM32EXL Keil, MCBSTM32EXL Datasheet - Page 53
MCBSTM32EXL
Manufacturer Part Number
MCBSTM32EXL
Description
BOARD EVALUATION FOR STM32F103ZE
Manufacturer
Keil
Specifications of MCBSTM32EXL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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RM0008
4
4.1
Note:
1
Power control (PWR)
Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes.
High-density devices are STM32F101xx and STM32F103xx microcontrollers where the
Flash memory density ranges between 256 and 512 Kbytes.
Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.
This section applies to the whole STM32F10xxx family, unless otherwise specified.
Power supplies
The device requires a 2.0-to-3.6 V operating voltage supply (V
is used to supply the internal 1.8 V digital power.
The real-time clock (RTC) and backup registers can be powered from the V
the main V
Figure 4.
V
DDA
and V
(from 2.4 V up to V
DD
SSA
Power supply overview
supply is powered off.
must be connected to V
(V
(V
(V
SSA
DDA
DD
SS
)
)
)
)
V
V
V
V
REF-
REF+
V
V
V
Doc ID 13902 Rev 9
DDA
SSA
BAT
SS
DD
Low voltage detector
DD
and V
Backup domain
LSE crystal 32K osc
BKP registers
RCC BDCR register
RTC
Voltage Regulator
V
I/O Ring
Standby circuitry
(Wakeup logic,
IWDG)
DD
SS
A/D converter
Temp. sensor
Reset block
PLL
V
DDA
, respectively.
domain
domain
DD
). An embedded regulator
1.8 V domain
peripherals
Memories
Power control (PWR)
digital
Core
BAT
voltage when
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