MCBSTM32EXL Keil, MCBSTM32EXL Datasheet - Page 952

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MCBSTM32EXL

Manufacturer Part Number
MCBSTM32EXL
Description
BOARD EVALUATION FOR STM32F103ZE
Manufacturer
Keil
Datasheets

Specifications of MCBSTM32EXL

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Debug support (DBG)
29
29.1
952/995
Debug support (DBG)
Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes.
High-density devices are STM32F101xx and STM32F103xx microcontrollers where the
Flash memory density ranges between 256 and 512 Kbytes.
Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.
This Section applies to the whole STM32F10xxx family, unless otherwise specified.
Overview
The STM32F10xxx is built around a Cortex-M3 core which contains hardware extensions for
advanced debugging features. The debug extensions allow the core to be stopped either on
a given instruction fetch (breakpoint) or data access (watchpoint). When stopped, the core’s
internal state and the system’s external state may be examined. Once examination is
complete, the core and the system may be restored and program execution resumed.
The debug features are used by the debugger host when connecting to and debugging the
STM32F10xxx MCU.
Two interfaces for debug are available:
Serial wire
JTAG debug port
Doc ID 13902 Rev 9
RM0008

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