HD6417760BL200AV Renesas Electronics America, HD6417760BL200AV Datasheet - Page 1371

SH4 7760, 17 X17 256BGA, LCDC, U

HD6417760BL200AV

Manufacturer Part Number
HD6417760BL200AV
Description
SH4 7760, 17 X17 256BGA, LCDC, U
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417760BL200AV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

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Part Number:
HD6417760BL200AV
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Quantity:
10 000
Part Number:
HD6417760BL200AV
Manufacturer:
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Quantity:
20 000
33.3.15 MFI Electrical Characteristics
(1) MFI AC characteristics
Figure 33.72 shows the AC characteristics of 68 series bus. Figure 33.73 and 33.74 show the AC
characteristics of 80 series bus.
Table 33.23 AC Characteristics of 68 Series Bus
(V
Item
Read bus cycle time
Write bus cycle time
Address setup time (MFI-RS)
Address hold time (MFI-RS)
Enable high width (Read)
Enable low width (Write)
Enable low width
Read data delay time
Read data hold time
Write data setup time
Write data hold time
Notes: 1. t
DDQ
= 3.0 to 3.6 V, V
2. t
overlapped.
Pcyc
MFIWEH
: one Pck cycle time
is the time where the low level of MFI-CS and the high level of MFI-E/WR are
(MFI-RW/RD)
(MFI-RW/RD)
DD
= 1.5 V, T
a
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
= −20 to 75°C/−40 to 85°C, C
MFICYCR
MFICYCW
MFIAS
MFIAS
MFIAH
MFIAH
MFIWRH
MFIWEH
MFIWEL
MFIRDD
MFIRDH
MFIWDS
MFIWDH
Min.
4 × t
3 × t
0
10
0
10
2.5 × t
1.5 × t
2.0 × t
0
t
10
Pcyc
+ 10
Pcyc
Pcyc
Pcyc
Pcyc
Pcyc
+ 10
+ 10
Rev. 2.00 Feb. 12, 2010 Page 1287 of 1330
+ 5
Max.
2 × t
L
= 30 pF, PLL2 on)
Pcyc
+ 10
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
REJ09B0554-0200
Figure
33.72

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