HD6417760BL200AV Renesas Electronics America, HD6417760BL200AV Datasheet - Page 517

• Manufacturer Part Number: HD6417760BL200AV
• Description: SH4 7760, 17 X17 256BGA, LCDC, U
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417760BL200AV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
• Peripherals: DMA, LCD, POR, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Two types of transfer are available in single address mode: (1) transfer between an external
device with DACK and a memory-mapped external device, and (2) transfer between an
external device with DACK and external memory. Only the external request signal (DREQ) is
used in both of these cases.
Figure 11.7 shows the transfer timing for single address mode.
The access timing depends on the type of external memory. For details, see the descriptions of
the memory interfaces in section 10, Bus State Controller (BSC).
D31–D0
D31–D0
A28–A0
A28–A0
Figure 11.7 DMA Transfer Timing in Single Address Mode
DACK
DACK
CKIO
CKIO
CSn
CSn
WE
RD
(a) From external device with DACK to external memory space
(b) From external memory space to external device with DACK
Address output to external memory
space
Data output from external device
with DACK
DACK signal to external
device with DACK
WE signal to external memory space
Address output to external memory
space
Data output from external memory
space
RD signal to external memory space
DACK signal to external
device with DACK
Rev. 2.00 Feb. 12, 2010 Page 433 of 1330
REJ09B0554-0200