HD6417760BL200AV Renesas Electronics America, HD6417760BL200AV Datasheet - Page 711

• Manufacturer Part Number: HD6417760BL200AV
• Description: SH4 7760, 17 X17 256BGA, LCDC, U
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417760BL200AV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
• Peripherals: DMA, LCD, POR, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

The smart card interface supports IC cards (smart cards) conforming to the ISO/IEC 7816-3
(Identification Card) specification.
18.1
The SIM has the following features.
• Communication functions
• Baud rate freely specifiable with internal baud rate generator
• Four types of interrupt factor
• DMA transfer
Legend: etu (Elementary time unit): Time for 1-bit transfer
Asynchronous half-duplex transmission
Protocol selectable between T = 0 and T = 1 modes
Data length: 8 bits
Parity bit generation and check
Extra guard time selectable
Output clock cycles per etu selectable
Transmission of error signal (parity error) in receiver mode with T = 0
Detection of error signal and automatic character repetition in transmitter mode with T = 0
Minimum character interval 11 etu selectable for T = 1
Direct convention/inverse convention selectable
Output clock fixable in high or low state
Transmit data empty, receive data full, transmit/receive error, transmission complete
The direct memory access controller (DMAC) can be activated to be used for data transfer
using a transmit data empty DMA transfer request or a receive data full DMA transfer request.
The receiver can observe the interval between the start of two successive characters.
Features
Section 18 SIM Card Module (SIM)
Rev. 2.00 Feb. 12, 2010 Page 627 of 1330
REJ09B0554-0200