HD6417760BL200AV Renesas Electronics America, HD6417760BL200AV Datasheet - Page 83

• Manufacturer Part Number: HD6417760BL200AV
• Description: SH4 7760, 17 X17 256BGA, LCDC, U
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417760BL200AV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
• Peripherals: DMA, LCD, POR, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Section 31 User Break Controller (UBC)
Table 31.1
Table 31.1
Section 33 Electrical Characteristics
Table 33.1
Table 33.2
Table 33.3
Table 33.4
Table 33.5
Table 33.6
Table 33.7
Table 33.8
Table 33.9
Table 33.10 TMU Module Signal Timing................................................................................ 1273
Table 33.11 SCIF Module Signal Timing ................................................................................ 1274
Table 33.12 H-UDI Module Signal Timing ............................................................................. 1275
Table 33.13 CMT Module Signal Timing ................................................................................ 1276
Table 33.14 HCAN2 Module Signal Timing ........................................................................... 1277
Table 33.15 GPIO Signal Timing............................................................................................. 1278
Table 33.16 Truth Table of I
Table 33.17 I
Table 33.18 I
Table 33.19 I
Table 33.20 HSPI Module Signal Timing ................................................................................ 1282
Table 33.21 USB DC characteristics........................................................................................ 1284
Table 33.22 USB AC characteristics........................................................................................ 1285
Table 33.23 AC Characteristics of 68 Series Bus..................................................................... 1287
Table 33.24 AC Characteristics of 80 Series Bus..................................................................... 1288
Table 33.25 SIM Module Signal Timing.................................................................................. 1290
Table 33.26 MMCIF Module Signal Timing ........................................................................... 1290
Table 33.27 LCDC Module Signal Timing .............................................................................. 1292
Table 33.28 HAC Interface Module Signal Timing ................................................................. 1293
Table 33.29 SSI Interface Module Signal Timing.................................................................... 1294
Table 33.30 A/D Converter Characteristics ............................................................................. 1296
Appendix
Table B.1
Table B.2
Table B.3
Table B.4
Register Configuration (1).................................................................................... 1121
Register Configuration (2).................................................................................... 1122
Absolute Maximum Ratings................................................................................. 1225
DC Characteristics (T
Permissible Output Currents................................................................................. 1228
Clock Timing........................................................................................................ 1228
Clock and Control Signal Timing......................................................................... 1229
Control Signal Timing.......................................................................................... 1236
Bus Timing........................................................................................................... 1239
INTC Module Signal Timing ............................................................................... 1272
DMAC Module Signal Timing............................................................................. 1272
Clock Operating Modes (SH7760)....................................................................... 1301
Area 0 Memory Map and Bus Width ................................................................... 1301
Endian .................................................................................................................. 1302
MFI Mode/LCD Mode ......................................................................................... 1302
2
2
2
C DC Characteristics.......................................................................................... 1279
C Bus Interface Module Signal Timing ............................................................. 1280
C Schmitt characteristics.................................................................................... 1280
2
C I/O Buffer ............................................................................... 1279
a
= −20 to 75°C/−40 to 85°C) ............................................ 1226
Rev. 2.00 Feb. 12, 2010 Page lxxxi of lxxxii
REJ09B0554-0200