HD6417760BL200AV Renesas Electronics America, HD6417760BL200AV Datasheet - Page 521

SH4 7760, 17 X17 256BGA, LCDC, U

HD6417760BL200AV

Manufacturer Part Number
HD6417760BL200AV
Description
SH4 7760, 17 X17 256BGA, LCDC, U
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417760BL200AV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417760BL200AV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6417760BL200AV
Manufacturer:
RENENAS
Quantity:
20 000
(3) Relationship between DMA Transfer Type, Request Mode, and Bus Mode
Table 11.8 shows the relationship between the type of DMA transfer, the request mode, and the
bus mode.
Table 11.8 Relationship between DMA Transfer Type, Request Mode, and Bus Mode
Address
Mode
Single
Dual
Legend:
32B:
B:
C:
External: External request
Internal:
Notes: 1. External request, auto-request, or on-chip peripheral module request possible.
2. Auto-request or on-chip peripheral module request possible.
3. Only cycle steal mode when the transfer request source is an on-chip peripheral
4. Access size permitted for the on-chip peripheral module register that is the transfer
5. See tables 11.9 (1) and 11.9 (2) for the transfer sources and transfer destinations in
Cycle steal
32-byte burst transfer
Burst
Auto-request and on-chip peripheral module request
module other than the DMABRG.
source or transfer destination.
DMA transfer by means of an external request.
Type of Transfer
External device with DACK and
external memory
External device with DACK and
memory-mapped external device
External memory and external memory
External memory and
memory-mapped external device
Memory-mapped external device and
memory-mapped external device
External memory and
on-chip peripheral module
Memory-mapped external device and
on-chip peripheral module
Rev. 2.00 Feb. 12, 2010 Page 437 of 1330
Request
Mode
External
External
Internal*
external*
Internal*
external*
Internal*
external*
Internal*
Internal*
1
1
1
2
2
5
5
5
,
,
,
Bus
Mode
B/C
B/C
B/C
B/C
B/C
B/C*
B/C*
3
3
REJ09B0554-0200
Transfer Size
(Bits)
8/16/32/64/32B
8/16/32/64/32B
8/16/32/64/32B
8/16/32/64/32B
8/16/32/64/32B
8/16/32/64*
8/16/32/64*
4
4

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