HD6417760BL200AV Renesas Electronics America, HD6417760BL200AV Datasheet - Page 58

• Manufacturer Part Number: HD6417760BL200AV
• Description: SH4 7760, 17 X17 256BGA, LCDC, U
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417760BL200AV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
• Peripherals: DMA, LCD, POR, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

31.7 User Break Controller Stop Function............................................................................... 1143
Section 32 List of Registers.............................................................................1145
32.1 Register Addresses (by functional module, in order of the corresponding section
32.2 Register Bits..................................................................................................................... 1163
32.3 Register States in Each Operating Mode.......................................................................... 1207
Section 33 Electrical Characteristics ...............................................................1225
33.1 Absolute Maximum Ratings ............................................................................................ 1225
33.2 DC Characteristics ........................................................................................................... 1226
33.3 AC Characteristics ........................................................................................................... 1228
33.4 A/D Converter Characteristics ......................................................................................... 1296
33.5 AC Characteristic Test Conditions................................................................................... 1297
33.6 Change in Delay Time Based on Load Capacitance ........................................................ 1298
Appendix
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B.
Rev. 2.00 Feb. 12, 2010 Page lvi of lxxxii
REJ09B0554-0200
31.7.1 Transition to User Break Controller Stopped State............................................. 1143
31.7.2 Cancelling the User Break Controller Stopped State .......................................... 1143
31.7.3 Examples of Stopping and Restarting the User Break Controller....................... 1144
numbers) .......................................................................................................................... 1146
33.3.1 Clock and Control Signal Timing ....................................................................... 1229
33.3.2 Control Signal Timing ........................................................................................ 1236
33.3.3 Bus Timing ......................................................................................................... 1239
33.3.4 INTC Module Signal Timing.............................................................................. 1272
33.3.5 DMAC Module Signal Timing ........................................................................... 1272
33.3.6 TMU Module Signal Timing .............................................................................. 1273
33.3.7 SCIF Module Signal Timing............................................................................... 1274
33.3.8 H-UDI Module Signal Timing............................................................................ 1275
33.3.9 CMT Module Signal Timing .............................................................................. 1276
33.3.10 HCAN2 Module Signal Timing.......................................................................... 1277
33.3.11 GPIO Signal Timing ........................................................................................... 1278
33.3.12 I
33.3.13 HSPI Module Signal Timing .............................................................................. 1282
33.3.14 USB Electrical Characteristics............................................................................ 1284
33.3.15 MFI Electrical Characteristics ............................................................................ 1287
33.3.16 SIM Module Signal Timing ................................................................................ 1290
33.3.17 MMCIF Module Signal Timing.......................................................................... 1290
33.3.18 LCDC Module Signal Timing............................................................................. 1292
33.3.19 HAC Interface Module Signal Timing................................................................ 1293
33.3.20 SSI Interface Module Signal Timing .................................................................. 1294
Package Dimensions ........................................................................................................ 1299
Mode Pin Settings ............................................................................................................ 1301
.......................................................................................................1299
2
C Electrical Characteristics............................................................................... 1279