HD6417760BL200AV Renesas Electronics America, HD6417760BL200AV Datasheet - Page 68

SH4 7760, 17 X17 256BGA, LCDC, U

HD6417760BL200AV

Manufacturer Part Number
HD6417760BL200AV
Description
SH4 7760, 17 X17 256BGA, LCDC, U
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417760BL200AV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417760BL200AV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6417760BL200AV
Manufacturer:
RENENAS
Quantity:
20 000
Figure 17.22 Receive Data Sampling Timing in Asynchronous Mode ....................................... 625
Figure 17.23 Example of Synchronization Clock Transfer by DMAC ....................................... 626
Section 18 SIM Card Module (SIM)
Figure 18.1 Block Diagram of SIM........................................................................................... 628
Figure 18.2 Data Format Used by the Smart Card Interface ..................................................... 648
Figure 18.3 Examples of Initial Character Waveforms ............................................................. 650
Figure 18.4 Example of Initialization Flow............................................................................... 652
Figure 18.5 Example of Transmission Processing..................................................................... 653
Figure 18.6 Example of Reception Processing .......................................................................... 654
Figure 18.7 Received Data Sampling Timing in Smart Card Mode.......................................... 657
Figure 18.8 Repetition in the Smart Card Interface Receiver Mode.......................................... 657
Figure 18.9 Repetition Standby Mode (clock stopped) when the Smart Card Interface Is in
Figure 18.10 TEIE Set Timing .................................................................................................... 659
Figure 18.11 Procedure for Stopping the Clock and Restarting .................................................. 660
Figure 18.12 Example of Smart Card Interface Pin Connections................................................ 661
Section 19 I
Figure 19.1 I
Figure 19.2 I
Figure 19.3 Master Data Transmit format ................................................................................. 691
Figure 19.4 Master Data Receive format................................................................................... 691
Figure 19.5 Combination Transfer Format of Master Transfer ................................................. 691
Figure 19.6 10-Bit Address Data Transfer Format .................................................................... 692
Figure 19.7 10-Bit Address Data Receive Format..................................................................... 692
Figure 19.8 10-Bit Address Transmit/Receive Combination Format ........................................ 693
Figure 19.9 Data Transfer Mode Timing Chart ......................................................................... 695
Figure 19.10 Data Receive Mode Timing Chart.......................................................................... 696
Figure 19.11 Period for Setting FSB = 1 for which a Stop Condition (P) will be Correctly
Section 20 Serial Sound Interface (SSI) Module
Figure 20.1 Block Diagram of SSI Module............................................................................... 708
Figure 20.2 Philips Format (with no Padding) .......................................................................... 724
Figure 20.3 Philips Format (with Padding) ............................................................................... 724
Figure 20.4 Sony Format (with Serial Data First, Followed by Padding Bits) .......................... 725
Figure 20.5 Matsushita Format (with Padding Bits First, Followed by Serial Data)................. 725
Figure 20.6 Multichannel Format (4 Channels, No Padding).................................................... 727
Figure 20.7 Multichannel Format (6 Channels with High Padding).......................................... 727
Figure 20.8 Multichannel Format (8 Channels, with Padding Bits First, Followed by
Rev. 2.00 Feb. 12, 2010 Page lxvi of lxxxii
REJ09B0554-0200
Transmitter Mode................................................................................................... 658
Issued ..................................................................................................................... 705
Serial Data, with Padding)...................................................................................... 728
2
2
2
C Bus Interface
C Bus Interface Block Diagram ........................................................................... 663
C Bus Timing....................................................................................................... 690

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