HD6417760BL200AV Renesas Electronics America, HD6417760BL200AV Datasheet - Page 1392

• Manufacturer Part Number: HD6417760BL200AV
• Description: SH4 7760, 17 X17 256BGA, LCDC, U
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417760BL200AV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
• Peripherals: DMA, LCD, POR, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

I2C0_SCL(O/D)*
I2C0_SDA(O/D)*
I2C1_SCL(O/D)*
I2C1_SDA(O/D)*
Rev. 2.00 Feb. 12, 2010 Page 1308 of 1330
REJ09B0554-0200
Signal Name
MFI-RW/
LCD_FLM*
HAC_RES*
HAC_BIT_CLK0*
VCPWC/IRQ4*
VEPWC/IRQ5*
HSPI_TX/
SIM_D/
MCDAT*
HSPI_RX*
HSPI_CLK/
SIM_CLK/
MCCLK*
HSPI_CS/
SIM_RST/
MCCMD*
11
11
11
11
11
11
11
11
14
14
14
14
11
PF0
Pin Name
MFI-RW
LCD_FLM
PE2
HAC_RES
PJ6
HAC_BIT_CLK0
PJ7
IRQ4
VCPWC
PE1
IRQ5
VEPWC
PE0
HSPI_TX
SIM_D
MCDAT
PF3
HSPI_RX
PF2
HSPI_CLK
SIM_CLK
MCCLK
PF1
HSPI_CS
SIM_RST
MCCMD
I/O
I/O
I/O
I/O
I/O
I/O
I
O
I/O
O
I/O
I
I/O
I
O
I/O
I
O
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
O
O
I/O
I/O
O
I/O
I
I
I
I
PI
Power-on
PZ
PZ
PZ
PZ
PZ
PZ
PZ
PZ
L
PZ
PZ
L
PZ
PI
PI
PI
PI
PI
PI
PI
PZ
PZ
PI
PI
PZ
PI
Reset
I
I
I
I
I/O
Manual
I
O
I/O
O
I/O
I
I/O
I
L
I/O
I
L
I/O
I
I
I
I/O
I
I/O
I
O
O
I/O
I
O
I
Sleep
I
O
I/O
O
I/O
I
I/O
I
O
I/O
I
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
O
O
I/O
I/O
O
I/O
I/O
Software
Z
O
Z/O
O
I/O
Z
Z/O
I
O
I/O
I
O
I/O
I/O
I/O
I/O
I/O
Z/O
Z/O
Z/O
Z/O
Z
Z/O
Z/O
O
O
Z/O
Z/O
O
Z/O
Z/O
Standby
I/O
I/O
I/O
I/O
Z
Hardware
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
I/O
I/O
I/O
I/O
I/O
Bus
Release
I
O
I/O
O
I/O
I
I/O
I
O
I/O
I
O
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
O
O
I/O
I/O
O
I/O